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(R) STPS160A/U POWER SCHOTTKY RECTIFIER MAIN PRODUCT CHARACTERISTICS IF(AV) VRRM Tj (max) VF (max) FEATURES AND BENEFITS n n n n n 1A 60 V 150C 0.57 V VERY SMALL CONDUCTION LOSSES NEGLIGIBLE SWITCHING LOSSES LOW FORWARD VOLTAGE DROP SURFACE MOUNTED DEVICE AVALANCHE CAPABILITY SPECIFIED SMA (JEDEC DO-214AC) STPS160A SMB (JEDEC DO-214AA) STPS160U DESCRIPTION Single chip Schottky rectifier suited for Switched Mode Power Supplies and high frequency DC to DC converters. Packaged in SMA or SMB, this device is intended for surface mounting and used in low voltage, high frequency inverters, free wheeling and polarity protection applications. ABSOLUTE RATINGS (limiting values) Symbol VRRM IF(RMS) IF(AV) IFSM IRRM IRSM PARM Tstg Tj dV/dt *: RMS forward current Average forward current Surge non repetitive forward current Repetitive peak reverse current Non repetitive peak reverse current Repetitive peak avalanche power Storage temperature range Maximum junction temperature * Critical rate of rise of reverse voltage TLead = 130C tp = 10 ms Sinusoidal tp = 2 s square F = 1kHz tp = 100 s tp = 1s square Tj = 25C = 0.5 Parameter Repetitive peak reverse voltage Value 60 10 1 75 1 1 2400 - 65 to + 150 150 10000 V/s Unit V A A A A A W C dPtot 1 thermal runaway condition for a diode on its own heatsink < dTj Rth( j - a ) 1/6 July 2003 - Ed: 6A STPS160A/U THERMAL RESISTANCES Symbol Rth (j-l) Junction to lead Parameter SMA SMB STATIC ELECTRICAL CHARACTERISTICS Symbol IR * Tests Conditions Reverse leakage current Tests Conditions Tj = 25C Tj = 125C VF * Forward voltage drop Tj = 25C Tj = 125C Tj = 25C Tj = 125C Pulse test : * tp = 380 s, < 2% Value 30 23 Unit C/W Min. Typ. Max. 4 Unit A mA V VR = 60V 1.1 IF = 1 A IF = 1 A IF = 2 A IF = 2 A 0.58 0.49 4 0.67 0.57 0.8 0.65 To evaluate the maximum conduction losses use the following equation : P = 0.49 x IF(AV) + 0.08 x IF2(RMS) Fig. 1: Average forward power dissipation versus average forward current. PF(av)(W) 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0.0 0.2 0.4 IF(av) (A) 0.6 0.8 =tp/T T Fig. 2: Average forward current versus ambient temperature (=0.5). IF(av)(A) = 0.1 = 0.05 = 0.2 = 0.5 1.2 Rth(j-a)=Rth(j-l) 1.0 =1 0.8 0.6 0.4 0.2 tp T SMA Rth(j-a)=100C/W S(Cu)=1.5cm SMB Rth(j-a)=80C/W S(Cu)=1.5cm 1.0 1.2 0.0 =tp/T tp Tamb(C) 50 75 100 125 150 0 25 2/6 STPS160A/U Fig. 3: Normalized avalanche power derating versus pulse duration. PARM(tp) PARM(1s) 1 Fig. 4: Normalized avalanche power derating versus junction temperature. PARM(tp) PARM(25C) 1.2 1 0.1 0.8 0.6 0.01 0.4 0.2 0.001 0.01 0.1 1 tp(s) 10 100 1000 Tj(C) 0 0 25 50 75 100 125 150 Fig. 5-1: Non repetive surge peak forward current versus overload duration (maximum values) (SMB). IM(A) 8 7 6 5 4 3 2 1 0 1E-3 IM t Fig. 5-2: Non repetive surge peak forward current versus overload duration (maximum values) (SMA). IM(A) 8 7 6 Ta=25C 5 4 3 Ta=25C Ta=50C Ta=50C IM t Ta=100C =0.5 2 1 0 1E-3 Ta=100C =0.5 t(s) 1E-2 1E-1 1E+0 t(s) 1E-2 1E-1 1E+0 Fig. 6-1: Relative variation of thermal impedance junction to ambient versus pulse duration (SMB). Zth(j-a)/Rth(j-a) 1.0 0.9 Printed circuit board: S(Cu)=1.5cm (e=35m) 0.8 0.7 0.6 =0.5 0.5 0.4 0.3 =0.2 0.2 =0.1 0.1 tp(s) Single pulse 0.0 1E-2 1E-1 1E+0 1E+1 Fig. 6-2: Relative variation of thermal impedance junction to ambient versus pulse duration (SMA). Zth(j-a)/Rth(j-a) 1.0 0.9 Printed circuit board: S(Cu)=1.5cm (e=35m) 0.8 0.7 0.6 =0.5 0.5 0.4 0.3 =0.2 0.2 =0.1 0.1 tp(s) Single pulse 0.0 1E-2 1E-1 1E+0 T T =tp/T tp =tp/T tp 1E+2 1E+3 1E+1 1E+2 3/6 STPS160A/U Fig. 7: Reverse leakage current versus reverse voltage applied (typical values). IR(A) 1E+3 Tj=100C Fig. 8: Junction capacitance versus reverse voltage applied (typical values). C(pF) 200 F=1MHz Tj=25C 1E+2 Tj=75C 100 50 1E+1 1E+0 1E-1 Tj=25C 20 VR(V) 0 5 10 15 20 25 30 35 40 45 50 55 60 VR(V) 10 1 2 5 10 20 50 100 Fig. 9: Forward voltage drop versus forward current (maximum values). Fig. 10-1: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board, copper thickness: 35m)(SMB). Rth(j-a) (C/W) 100 IFM(A) 1E+1 Tj=125C 80 Tj=25C 1E+0 60 40 20 1E-1 VFM(V) 1E-2 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 S(Cu) (cm) 0 0 1 2 3 4 5 Fig. 10-2: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board, copper thickness: 35m)(SMA). Rth(j-a) (C/W) 140 120 100 80 60 40 20 0 0 1 S(Cu) (cm) 2 3 4 5 4/6 STPS160A/U PACKAGE MECHANICAL DATA SMA DIMENSIONS E1 REF. Millimeters Min. Max. 2.70 0.20 1.65 0.41 5.60 4.60 2.95 1.60 Inches Min. 0.075 0.002 0.049 0.006 0.189 0.156 0.089 0.030 Max. 0.106 0.008 0.065 0.016 0.220 0.181 0.116 0.063 A1 D 1.90 0.05 1.25 0.15 4.80 3.95 2.25 0.75 A2 b c E E A1 E1 D b C L A2 L FOOT PRINT DIMENSIONS ( in millimeters) 1.65 1.45 2.40 1.45 5/6 STPS160A/U PACKAGE MECHANICAL DATA SMB DIMENSIONS REF. D E1 Millimeters Min. Max. 2.45 0.20 2.20 0.41 5.60 4.60 3.95 1.60 Inches Min. 0.075 0.002 0.077 0.006 0.201 0.159 0.130 0.030 Max. 0.096 0.008 0.087 0.016 0.220 0.181 0.156 0.063 A1 A2 b E 1.90 0.05 1.95 0.15 5.10 4.05 3.30 0.75 c A1 E E1 b C L A2 D L FOOT PRINT DIMENSIONS ( in millimeters) 2.3 1.52 Ordering type STPS160A STPS160U n n 2.75 Marking GA6 E16 1.52 Package SMA SMB Weight 0.068 g. 0.107 g. Base qty 5000 2500 Delivery mode Tape & reel Tape & reel BAND INDICATES CATHODE EPOXY MEETS UL94,V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics (c) 2003 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 6/6 |
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